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QFN/DFN Packaging (Quad Flat No-lead Package)
Product Introduction

QFN, (Quad Flat No lead Package), can be applied in various fields such as computer, communication, consumer electronics,  electrics cars. It is a packaging technology that with broad prospects.


Technical advantages

① The product has excellent heat dissipation and reliability performance, and can pass MSL level 1 testing;

② Especially suitable for highly cost-effectiveness and high reliability such as consumer, automotive and military electronics ;

③ Single or multi chips packaging solutions.

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