EN
Product Center
WIoS Packaging (Wafer Interconnection on Substrate)
Product Introduction

Applying hybrid bonding process, wafers with different fabrication and IPs are bonded together, and then packaged with substrates to achieve integration of storage and computing , and multi IP integration. This packaging asks extremely high requirements for performance like warpage, and heat dissipation.


Technical advantages

① Different IP chips through hybrid bondng can reach micrometer spacing , with high rate data transmission and low dissipation, which meets the requirement of  high speed, high bandwidth and high power product.
②It can greatly reduce wafer fabrication cost, improve IP repeating utilization rate and shorten products validation cycle by integration of different different fabrication, multiple IPs, and large-sized chips.




" class="hidden">椒江人力网